Product Description:
The Photoelectric Sensors product offers reliable detection capabilities for various applications. With a spot size (max.) far range of 0.15x0.15mm, these sensors deliver precise and accurate results. The IEC/JIS Rating (FDA Rating) of Class 2 (Class II) ensures compliance with industry standards, making them suitable for a wide range of environments.
What is a CMOS Laser Displacement Photoelectric Sensor?
A CMOS Laser Displacement Photoelectric Sensor is a high-precision sensor that uses a laser beam and a CMOS image chip to measure the exact distance between the sensor and a target surface without touching it.
| Cable Type | 2CH | KD50-50N |
| Output Signal | Switching output: NPN (-N), |
| Detection Range | 50±10mm |
| Full Scale(F.S.) | 20mm |
| Light Source | Red Laser diode (wavelength 655nm) |
| IEC/JIS Rating(FDA Rating) | Class 2(Class Ⅱ ) |
| Sampling Period | 500(250mm:750)/1000/1500/2000μs |
| Response Time | High-speed Mode | max.5ms: sampling average x 1 (1ms) + sensitivity switch time (max.4ms) |
| Standard Mode | max.12.5ms: sample average x 16 (8.5ms) + sensitivity switch time (max.4ms) |
High-resolution
Mode | max.36.5ms: sampling average x 64 (32.5ms) + sensitivity switch time (max.4ms) |
Sensitivity Switch
Time | 4ms max. |
| Operating Temp./Humidity | -10~45° C/35~85%RH(no condensation or icing) |
| Shock Resistance | 50G(500m/s²) |
| Housing Material | Housing: PBT Lens: PMMA |
| Vibration Resistance | 10~55Hz, double amplitude 1.5mm,X,Y,Z directions, 2 hour for each |
Applications:
KRONZ Photoelectric Sensors are versatile devices suitable for a wide range of applications across various industries. With a compact design and high precision technology, these sensors offer reliable performance in different scenarios.
CMOS laser mounted photoelectric sensors for the electronics/semiconductor industry
- PCB Component Height Inspection: Measures the height of chips, capacitors, and other components on printed circuit boards to ensure proper placement.
- Die Bonding and Chip Alignment: Ensures precision alignment of chips during packaging and bonding processes.
- Wafer Thickness and Warpage Detection: Used in wafer polishing or cutting processes to control material removal and prevent damage.
- FPC (Flexible PCB) Thickness Measurement: Ensures uniform lamination and layer thickness in flexible circuit boards.
